Solder Paste NO-Clean 500GR Tub [SOLDER PASTE 500G] .::. Communica Online

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Solder Paste NO-Clean 500GR Tub

NO-Clean / 500GR / Tub Solder Paste

Solder Paste NO-Clean 500GR Tub Kester (EP256 62/36/2)

Part No: SOLDER PASTE 500G

	Discontinued

Specifications, Prices & Availability may change without notice. Images are for illustration purposes only. E&OE

Overview

Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solderpaste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.

Specifications

Stable wetting behavior over a wide range of profiles
Capable of 90 minute break times in printing
High print speeds to 200+ mm/sec (8+ in/sec)
Compatible with enclosed print head systems
Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder
High activity on all substrates, including OSPs
Capable of off-pad printing with no solderballs after reflow
Stencil life: 8+ hours (process dependent)
Scrap is reduced due to less paste dry out
Stable tack over 8+ hours
Classified as ROL0 per J-STD-004
Compliant to Bellcore GR-78

Downloads

Datasheet - SOLDER PASTE 500G

PDF File

54.90 KB