1. Catalog
    2. >
  2. Consumer Electronics
    3. >
  3. Kits
    4. >
  4. Various Kits
D1 ESP 32 DEV BOARD WITH CP2104 CHIP. CPU AND MEMORY: XTENSA 32-BIT LX6 DUAL-CORE PROCESSOR, UP TO 600 DMIPS,448 KBYTES ROM,520 KBYTES SRAM,16 KBYTES SRAM IN THE RTC. [HKD D1 MINI ESP 32 DEV BOARD]
D1 ESP 32 DEV BOARD WITH CP2104 CHIP. CPU AND MEMORY: XTENSA 32-BIT LX6 DUAL-CORE PROCESSOR, UP TO 600 DMIPS,448 KBYTES ROM,520 KBYTES SRAM,16 KBYTES SRAM IN THE RTC. [HKD D1 MINI ESP 32 DEV BOARD] D1 ESP 32 DEV BOARD WITH CP2104 CHIP. CPU AND MEMORY: XTENSA 32-BIT LX6 DUAL-CORE PROCESSOR, UP TO 600 DMIPS,448 KBYTES ROM,520 KBYTES SRAM,16 KBYTES SRAM IN THE RTC. [HKD D1 MINI ESP 32 DEV BOARD] D1 ESP 32 DEV BOARD WITH CP2104 CHIP. CPU AND MEMORY: XTENSA 32-BIT LX6 DUAL-CORE PROCESSOR, UP TO 600 DMIPS,448 KBYTES ROM,520 KBYTES SRAM,16 KBYTES SRAM IN THE RTC. [HKD D1 MINI ESP 32 DEV BOARD]

D1 ESP 32 Develoment Board

D1 ESP 32 Develoment Board

HKD D1 MINI ESP 32 DEV BOARD
D1 ESP 32 DEV BOARD WITH CP2104 CHIP. CPU AND MEMORY: XTENSA 32-BIT LX6 DUAL-CORE PROCESSOR, UP TO 600 DMIPS,448 KBYTES ROM,520 KBYTES SRAM,16 KBYTES SRAM IN THE RTC.
Discontinued
Specifications, Prices & Availability may change without notice. Images are for illustration purposes only. E&OE

Overview

ESP32 is a single 2.4 GHz Wi-Fi-and-Bluetooth combo chip designed with the TSMC ultra-low-power 40 nm technology. It is designed to achieve the best power and RF performance, showing robustness, versatility and reliability in a wide variety of applications and power scenarios. Here it is available in a form factor that resembles that of the Wemos D1 Mini with the same footprint and pin-outs.

Specifications

  • CPU and Memory: Xtensa® 32-bit LX6 Dua-core processor, up to 600 DMIPS
  • 448 Kbytes ROM
  • 520 Kbytes SRAM
  • 16 Kbytes SRAM in the RTC
  • QSPI can connect up to 4 x Flash/SRAM, each flash should be less than 16 Mbytes
  • Supply Voltage: 2.2 V~3.6 V