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POTTING COMPOUND RIGID 1KG- RESIN/160G HARDNER-MIXING RATIO BY VOLUME 100 CCS X 35CCS BROWN [RESIN FR476 1KG]
POTTING COMPOUND RIGID 1KG- RESIN/160G HARDNER-MIXING RATIO BY VOLUME 100 CCS X 35CCS BROWN [RESIN FR476 1KG]

Potting Compound

Potting Compound

RESIN FR476 1KG
POTTING COMPOUND RIGID 1KG- RESIN/160G HARDNER-MIXING RATIO BY VOLUME 100 CCS X 35CCS BROWN
375.06 ZAR
inc
for 1 Each
6 in Stock
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Specifications, Prices & Availability may change without notice. Images are for illustration purposes only. E&OE

Overview

Medium viscosity epoxy casting resin system for encapsulation of electrical and electronic equipment. Tek113B provides good gloss finish and medium reactivity. Standard hardener for electronic potting.

Features

Resin Fr476

Specifications

  • Colour: Brown
  • Mixing Ratio
    • ER130 : 100 pbw
    • TEK113B : 16 pbw
  • Density
    • ER130: 1.60
    • Tek113B: 0.95
  • Viscosity
    • ER130 : 30000 to 60000 mPa.s at 25°C
    • TEK113B : 300 to 500 mPa.s at 25°C
  • Pot Life: 30 to 40 minutes at 25°C
  • Gelation Time: 2 to 2 1/2 Hours at 25°C (Test tube Gelnorm DIN 16945)
  • Curing Time : 4 to 5 hours at 25°C (500 Grams)

Characteristics After Cure

  • Hardness : 75 Shore D after 3 days at 25°C
  • Dielectric Strength : 1.3 KV/mm (Approx.)
  • Heat Distortion Temperature : 60°C
  • Continuous Temp. of Operation : 70°C (25000 h weight loss)

Additional Information

Group Adhesives
Quantity 1Kg
Packaging Tin

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