Catalog > Consumer Electronics > Electro-Chemicals > Adhesives Solder Paste Solder Paste Lower Density SOLDER PASTE 35 Solder Paste • 35g Tube 476.52 ZAR inc for 1 Each 0 in Stock Add Specifications, Prices & Availability may change without notice. Images are for illustration purposes only. E&OE Overview Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes. The flow character- istics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters. Features Excellent dispensing characteristics using 22 gage needles and Type 3 powderManufactured and packaged void-free to insure the most consistent dispensibility availableCapable of several thousands of dots per hour in high speed automated dispense equipmentHigh activity on all substrates, including OSPsStable tack over 8+ hoursAvailable with lead-free alloysCompatible with Kester Easy Profile 256 stenciling solderpasteClassified as ROL0 per J-STD-004Compliant to Bellcore GR-78 Additional Information Group Adhesives Quantity 35g Packaging Tube Downloads Datasheet - SOLDER PASTE 35 PDF File 160.68 KB