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D1 ESP 32 Develoment Board, CPU and Memory: Xtensa 32-Bit LX6 Dual-Core Processor, up to 600 DMIPS, 448 Kilobytes Rom, 520 Kilobytes SRAM, 16 Kilobytes SRam in the RTC. [HKD D1 MINI ESP 32 DEV BOARD]
D1 ESP 32 Develoment Board, CPU and Memory: Xtensa 32-Bit LX6 Dual-Core Processor, up to 600 DMIPS, 448 Kilobytes Rom, 520 Kilobytes SRAM, 16 Kilobytes SRam in the RTC. [HKD D1 MINI ESP 32 DEV BOARD] D1 ESP 32 Develoment Board, CPU and Memory: Xtensa 32-Bit LX6 Dual-Core Processor, up to 600 DMIPS, 448 Kilobytes Rom, 520 Kilobytes SRAM, 16 Kilobytes SRam in the RTC. [HKD D1 MINI ESP 32 DEV BOARD] D1 ESP 32 Develoment Board, CPU and Memory: Xtensa 32-Bit LX6 Dual-Core Processor, up to 600 DMIPS, 448 Kilobytes Rom, 520 Kilobytes SRAM, 16 Kilobytes SRam in the RTC. [HKD D1 MINI ESP 32 DEV BOARD]

D1 ESP 32 Develoment Board

D1 / ESP 32 Develoment Board
D1 ESP 32 Develoment Board, CPU and Memory: Xtensa 32-Bit LX6 Dual-Core Processor, up to 600 DMIPS, 448 Kilobytes Rom, 520 Kilobytes SRAM, 16 Kilobytes SRam in the RTC.
Part No: HKD D1 MINI ESP 32 DEV BOARD
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Specifications, Prices & Availability may change without notice. Images are for illustration purposes only. E&OE

Overview

ESP32 is a single 2.4 GHz Wi-Fi-and-Bluetooth combo chip designed with the TSMC ultra-low-power 40 nm technology. It is designed to achieve the best power and RF performance, showing robustness, versatility and reliability in a wide variety of applications and power scenarios. Here it is available in a form factor that resembles that of the Wemos D1 Mini with the same footprint and pin-outs.

Specifications

  • CPU and Memory: Xtensa® 32-bit LX6 Dua-core processor, up to 600 DMIPS
  • 448 Kbytes ROM
  • 520 Kbytes SRAM
  • 16 Kbytes SRAM in the RTC
  • QSPI can connect up to 4 x Flash/SRAM, each flash should be less than 16 Mbytes
  • Supply Voltage: 2.2 V~3.6 V

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