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Potting Compound with 100 pbw ER130 and 16 pbw TEK113B Mixing Ratio in 1Kg Tin [RESIN FR476 1KG]
Potting Compound with 100 pbw ER130 and 16 pbw TEK113B Mixing Ratio in 1Kg Tin [RESIN FR476 1KG]

RESIN FR476 1KG

Potting Compound
Potting Compound with 100 pbw ER130 and 16 pbw TEK113B Mixing Ratio in 1Kg Tin
Part No: RESIN FR476 1KG
336.95 ZAR
inc
for 1 Each
Specifications, Prices & Availability may change without notice. Images are for illustration purposes only. E&OE

Overview

Medium viscosity epoxy casting resin system for encapsulation of electrical and electronic equipment. Tek113B provides good gloss finish and medium reactivity. Standard hardener for electronic potting.

Features

Resin Fr476

Specifications

  • Colour: Brown
  • Mixing Ratio
    • ER130 : 100 pbw
    • TEK113B : 16 pbw
  • Density
    • ER130: 1.60
    • Tek113B: 0.95
  • Viscosity
    • ER130 : 30000 to 60000 mPa.s at 25°C
    • TEK113B : 300 to 500 mPa.s at 25°C
  • Pot Life: 30 to 40 minutes at 25°C
  • Gelation Time: 2 to 2 1/2 Hours at 25°C (Test tube Gelnorm DIN 16945)
  • Curing Time : 4 to 5 hours at 25°C (500 Grams)

Characteristics After Cure

  • Hardness : 75 Shore D after 3 days at 25°C
  • Dielectric Strength : 1.3 KV/mm (Approx.)
  • Heat Distortion Temperature : 60°C
  • Continuous Temp. of Operation : 70°C (25000 h weight loss)

Additional Information

Group Adhesives
Quantity 1Kg
Packaging Tin

Downloads

PDF File
47.10 KB

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Communica is a wholesale and retail distributor of semiconductors, electromechanical and passive electronic components for automotives, electronics, electrical, automation, mining and process control industries and technical and tertiary educational institutions. We also offer a large range of security and CCTV equipment, power supplies, test instruments and accessories, tools and production equipment, prototyping platforms, and hobby and educational products.